ISO uses the term, Integrated Circuit Card (ICC) to encompass all those devices where an integrated circuit is contained within an ISO ID1 identification card. Identification cards — Integrated circuit(s) cards with contacts — Part 1: Physical characteristics. ISO/IEC specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which.
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The format of a character frame is shown in figure Mail this article Print this article. It specifies the physical characteristics, layout, recording techniques, numbering uso and registration procedures. The ICC is probably the security man’s dream because unlike most electronic storage and processing devices it has security intrinsically built in.
In the Smart Card world the term, application, is widely 7816–1 to describe the software or programs that the IC implements.
A mylar sheet is stuck to the back of the wafer so that following separation the dice remains attached to the mylar film. In both cases gold bumps are formed on the die.
The ISO standard defines three reset modes, internal reset, active low reset and synchronous high active reset. The bending properties are tested by deflecting the card on each axis as shown in figure 6.
Whilst the memory is erasable by means of ultra violet light, the necessary quartz window is never available in the ICC and the memory is really used in one time programmable mode OTP. Retrieved 19 April ISO is the internationally accepted standard for smart cards.
Integrated Circuit Cards come in two forms, contact and contactless. Newer chip fabrication technologies are moving sub micron, 0. In order of increasing real estate the PROM comes next. This is the signal line by which the chip receives commands and interchanges data with the outside world. As the title implies, this part of the standard specifies the location of embossed characters on an ID -1 card for which two areas are assigned.
These chips may operate with a supply voltage of 3volts which results in lower current consumption. The important point is more concerned with reliability since clearly the larger die will be more prone to mechanical fracture.
This article is continued on page 2. Apart from the above standards, some industry specific standards are also generally followed.
The sequence of operations for activating and deactivating the IC is defined in order to minimise the likelihood of damage to the IC. Conformance to ISO standards is also likely to be a requirement and in this area ISO – 3 Electronic signals and transmission protocols is the principle standard to be considered. More commonly the die are separated from the wafer by the use of a diamond saw.
There is a school of thought which envisages substantial changes in this area to account for the needs of multi-application cards where it is essential to provide the necessary security segregation. However in the semiconductor industry generally two other techniques are used, the flip chip process and tape ixo bonding.
Such an application may be totally implemented in the logic of the chip.
ISO/IEC – Wikipedia
One of the issues surrounding the use of the IC card relates to the temperature range for operational use. 78816-1 thickness of the card is particularly important for Smart Card readers because of the mechanical construction of the card connector mechanism. Vss is the substrate or ground reference voltage against which the Vcc potential is measured.
PVC was traditionally used in the manufacture of cards and enabled a higher printing resolution. The loaded data may contain, for example, code, keys and applets. The first three parts in particular are well established and allow total physical and electrical interoperability as well as defining the communication protocol between the IC card and the CAD Card Acceptor Device.
Got Something To Say: The choice of chip location has been a difficult subject due largely to the use of magnetic stripes.
The specification requires this voltage to be discharged across each of the contacts in both normal and reverse polarity. Although the ISO Isp defined eight contacts, only 6 are actually used to communicate with the outside world. There is another bi-product that we will consider later where the cost of testing and personalisation are considerably altered by the complexity of the particular chip.
7816–1 ISO standard includes specifications for the commands for card management. This means that the line must change direction depending on whether the IC is transmitting or receiving. The three most widely used tests applied by fabricators are specified in the annex to the standard: Because in general only 5 or 6 wires are iwo for Smart Card applications this approach is acceptable.